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ATP Introduces Copper Foil, Fin-Type Heatsink / Thermal Pad for NVMe M.2/U.2 SSDs with up to 3.84/8 TB Storage Customizable Thermal Management Solution Delivers Sustained Performance Improvements in Diverse High-Temp Scenarios

TAIPEI, Taiwan, March 28, 2021 (GLOBE NEWSWIRE) -- ATP Electronics, the global leader in specialized storage and memory solutions, announced the launch of its new NVMe flash storage solutions with customizable thermal management. Using both hardware and firmware components, the thermal management solution prevents overheating while ensuring optimal sustained performance, particularly for NVMe solid state drives (SSDs) and modules that operate at blazing-fast speeds while installed in compact systems with little or no airflow. Read More

from Financial Post https://ift.tt/39nOLMn
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